27th October 2015
With much fanfare, LeTV announced its new
flagship flagship-killer product, the LeTV 1s. Building on the success of its first product, the LeTV one that packed a octacore processor into an “budget” priced phone, the LeTV 1S improves on the winning formula. The most visible upgrade is the full metal unibody, a technology that allows the phone to be more durable and more compact – in fact they claim it cuts down the thickness of phone by 2mm. The second biggest change is the inclusion of a ultra responsive finger print reader on the back face of the phone – a design that is featured on other flagships like the LG G4. The other upgrades are more incremental – the screen has been upgrade to improve brightness, the camera has been upgraded to improve responsiveness, and the CPU is now 10% faster.
A feature that sounds really promising is their fast charge feature that is enabled with their new USB Type-C cable – a feature that could cut the time to charge the phone. LeTV claims that 3 hours of talk time could be obtained with just a 5 minutes charge. This sounds amazing if it works as advertised!
Whilst all these features sound great, they don’t deserve the “Flagship Killer” title. LeTV has a solution for that too – a huge price cut. Instead of selling this phone at the same price of the previous model, the chose to cut its price by 1/3, dropping the 1699 RMB price tag to a mere 1099RMB (172 USD). This seemly suicidal strategy has only been used by Amazon with their Kindle Fire tablets and have never been seen on a mobile phone. This phone is now priced at the Budget price point, but the performance and build is Samsung S6 level. It seems that LeTV is definitely looking at selling aftersale services such as their TV service to make their profit.
LeTV 1S Full Specs:
CPU : MediaTek helio X10 Turbo 8core 64bit ( 8×A53 )
GPU PowerVR G6200
RAM: 3GB LPDDR3 RAM
Back Camera: 13Megapixel F2.0, 4K recording
Front Camera: 5 Megapixel
Supports Bluetooth 4.0 (with apt-x)
Modem support: TD-LTE, FDD-LTE, WCDMA
More information could be found at: